Technology


  • Highly ductile separated copper, free of internal stresses, without crazing, with high conductivity
  • Layout structures from standard to ultra-fine conductor technology for a wide range of component housings and assembly versions such as "chip on board", BGA, CSP
  • Multilayer up to 12 layers, blind/buried vias in board technology. Maximum precision of the individual layers compared with each other thanks to four slot system
  • Combination multilayer of various materials
  • Rigid / flexible PCBs
  • Rear wall reinforced PCBs, through contact (Al,Ms,Cu)
  • Versions with solder resist, via hole filler, heat sink and plugging pastes
  • Special versions